The **ATS-03D-41-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **push-pin** heat sink product line designed for efficient cooling of electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Pin Material** | Brass | | **Spring Type** | Compression Spring | | **Thermal Resistance** | ~10.02 °C/W (at low airflow) to ~2.26 °C/W (at high airflow) | --- ### 2. Design Components The "Electronic" assembly of this part consists of several mechanical elements that work together to manage thermal loads: * **Finned Structure:** The "41" series typically features a straight-fin or cross-cut design. This increases the surface area available for convection cooling. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766** phase-change material. This fills microscopic air gaps between the component and the heat sink base to maximize heat transfer. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, the push-pin mechanism provides specific downward pressure. This ensures a consistent mechanical bond and improves thermal conductivity across the interface. --- ### 3. Part Number Breakdown The part number follows the standard ATS nomenclature: 1. **ATS**: Advanced Thermal Solutions (Manufacturer). 2. **03D**: Specifies the series/mounting style (Push-pin type). 3. **41**: Indicates the physical footprint/dimensions (40x40mm). 4. **C2**: Refers to the specific thermal performance/height configuration (25mm height). 5. **R0**: Standard revision/production code. --- ### 4. Application Use-Cases This heat sink is commonly used in the following electronic environments: * **Embedded Systems:** Cooling SoCs (System on Chips). * **Networking Gear:** Cooling high-speed switches and routers. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.