The **ATS-03D-35-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" series, designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Dimensions** | 36.83 x 36.83 x 9.50 mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 12.83°C/W (Unducted Flow @ 200 LFM) | | **Fin Style** | maxiFLOW (Tapered Fin Design) | | **Equivalent Series** | R-Series (High Performance) | --- ### 2. Design Characteristics This part is engineered for optimal airflow and thermal dissipation in constrained spaces. * **maxiFLOW™ Technology:** The heat sink features a unique flared fin structure. This design increases the surface area for heat dissipation while maintaining a low pressure drop, making it highly efficient for forced-air cooling. * **pushPIN™ Attachment:** Instead of messy adhesives or thermal tape, this part uses a mechanical push-pin system. This ensures consistent pressure across the interface material, improving heat transfer reliability. * **Pre-Applied Thermal Interface Material (TIM):** Most "R0" variants come with a high-performance thermal pad or phase-change material pre-applied to the base, simplifying the assembly process. --- ### 3. Part Number Breakdown The nomenclature for the ATS series provides specific information about the part: 1. **ATS:** Advanced Thermal Solutions (Manufacturer). 2. **03D:** Indicates the specific product family and attachment hardware. 3. **35:** Represents the base dimension (approx. 35-37mm). 4. **C2:** Refers to the specific thermal performance and material grade (Blue Anodized Aluminum). 5. **R0:** Revision code, often indicating the inclusion of specific thermal interface materials or mounting hardware. --- ### 4. Applications The ATS-03D-35-C2-R0 is typically found in: * **Telecommunications:** Cooling of high-speed network switches and routers. * **Embedded Systems:** Industrial PCs where space is limited but thermal output is high. * **Power Supplies:** Heat management for voltage regulators and power MOSFETs. ---