The **ATS-03D-182-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure system stability. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-pin (Spring-loaded) | | **Thermal Resistance** | 7.51°C/W (at 100 LFM) | | **Dimensions (L x W)** | 40.00mm x 40.00mm | | **Height (Height Off Base)** | 15.00mm | --- ### 2. Design and Component Breakdown #### A. Fin Design This part utilizes a **Cross-Cut fin pattern**. Unlike straight fins, cross-cut fins allow for multi-directional airflow, making it more efficient in systems where the direction of the cooling air might vary or be turbulent. #### B. Attachment System: pushPIN™ The "R0" designation refers to the specific attachment kit. * **Push-pins:** Plastic or brass pins that snap into pre-drilled holes on the PCB. * **Compression Springs:** These provide a precise amount of "clamping force" (pressure) between the heat sink and the electronic chip to maximize heat transfer. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766 Phase Change Material**. This is a high-performance thermal grease/pad substitute that melts slightly at operating temperatures to fill microscopic air gaps between the heat sink and the chip. --- ### 3. Application Use-Cases This specific size (40mm x 40mm) and height (15mm) is commonly used for: * **Network Switches:** Cooling ASICs and processors. * **Industrial PCs:** Cooling embedded CPU modules. * **Power Supplies:** Heat dissipation for MOSFET arrays. ---