ATS-03D-159-C1-R0
AI

The **ATS-03D-159-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed specifically for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits.
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### 1. Technical Specifications
Below are the primary mechanical and thermal properties of this component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions** | 45mm x 45mm x 10mm |
| **Thermal Resistance** | 10.68°C/W (Unducted Flow @ 100 LFM) |
| **Weight** | 35.53 grams |
| **Thermal Interface Material** | T766 (Pre-applied) |
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### 2. Key Electronic & Mechanical Features
#### A. Thermal Management Performance
The device is designed for low-profile applications where vertical space is limited (only 10mm high). It utilizes a **XC (Extra Coarse)** fin pitch, which is optimized for airflow environments to dissipate heat efficiently from the semiconductor package to the ambient air.
#### B. pushPIN™ Attachment System
Unlike adhesive-based heat sinks, this model uses a mechanical mounting system:
* **Precision Springs:** Ensure consistent pressure (clamping force) for optimal thermal contact.
* **Brass Components:** Provide durability and prevent loosening over time due to vibration or thermal expansion.
* **Ease of Assembly:** Features pre-drilled holes for rapid installation onto the PCB.
#### C. Thermal Interface Material (TIM)
The "C1" in the part number indicates that it comes with **T766** thermal grease pre-applied to the base. This ensures:
* Minimal air gaps between the component and the heat sink.
* Efficient heat transfer immediately upon installation.
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### 3. Part Number Breakdown
The nomenclature follows a specific logic:
| Code Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions |
| **03** | Series/Mounting Style (pushPIN) |
| **D** | Material Code (Aluminum) |
| **159** | Specific Fin Design/Height Profile |
| **C1** | Thermal Interface Material (T766) |
| **R0** | RoHS Compliant / Revision Status |
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- ⤷
What are the alternative mounting methods if pushPIN is not suitable for my PCB?
- ⤷ How does the 'Blue Anodized' finish affect the heat sink's thermal emissivity?
- ⤷ Can this heat sink be used with high-power MOSFETs in a vertical orientation?