The **ATS-03D-06-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc.* It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductor devices like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications | Parameter | Value / Detail | | :--- | :--- | | **Part Number** | ATS-03D-06-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Unducted)** | 20.17 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 4.56 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **TIM (Thermal Interface Material)** | T766 (High Performance) | --- ### 2. Key Electronic Features #### A. Fine Pitch Fin Design The "06" in the part number indicates the fin pattern. This heat sink utilizes a **Fine Pitch** straight fin design. This increases the total surface area, allowing for better heat dissipation in systems where there is high-velocity airflow (active cooling). #### B. Thermal Interface Material (TIM) The unit comes pre-applied with **T766 thermal grease**. * **Purpose:** It fills the microscopic air gaps between the heat sink base and the electronic component (IC). * **Benefit:** Reduces contact resistance and ensures maximum heat transfer from the silicon to the aluminum fins. #### C. pushPIN™ Attachment System Unlike adhesive tapes or simple clips, the pushPIN™ system uses a flexible spring-loaded mechanism. * **Constant Pressure:** Ensures the heat sink maintains a firm, even contact with the chip over time. * **Mechanical Stability:** Protects the electronic part from shifting during vibration or shipping. --- ### 3. Thermal Performance Summary As air velocity increases, the thermal resistance drops significantly, allowing the electronic part to operate at lower temperatures. | Air Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :--- | :--- | :--- | :--- | | **Resistance (°C/W)** | 20.17 | 8.11 | 4.67 | 3.33 | --- ### 4. Typical Applications * **Embedded Systems:** Cooling small form-factor processors. * **Telecommunications:** Cooling ASICs and network switch chips. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.