The **ATS-03B-91-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **heat sink** designed by Advanced Thermal Solutions (ATS) as part of their "push pin" attachment series. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 12.89°C/W (Unducted Flow @ 200 LFM) | | **Dimensions** | 40mm x 40mm x 10.00mm | | **Fin Style** | Straight Fin | --- ### 2. Electronic Component Breakdown #### A. The Heat Sink Body The main body is made of **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The blue anodized coating is not just aesthetic; it provides: * Increased surface emissivity for better radiation. * Protection against corrosion. * Electrical insulation of the surface. #### B. The Push Pin Mechanism Unlike adhesive-based heat sinks, the **ATS-03B-91-C2-R0** uses a mechanical push-pin system. - **Plastic Pins:** These pass through pre-drilled holes in the PCB. - **Compression Springs:** These ensure constant, uniform pressure (clamping force) between the heat sink and the electronic component (CPU, GPU, or MOSFET). This pressure is critical for minimizing the thermal resistance of the interface material. #### C. Thermal Interface Material (TIM) Usually, these parts come with a pre-applied **Phase Change Material (PCM)** or a thermal pad on the base. This fills the microscopic air gaps between the heat sink and the electronic chip to maximize heat transfer. --- ### 3. Application Use Cases This specific part is typically used for cooling small to medium-sized integrated circuits (ICs) in the following environments: 1. **Telecommunications:** For cooling high-speed networking chips. 2. **Embedded Systems:** For industrial PCs where vibration resistance (provided by the pins) is necessary. 3. **Power Electronics:** Dissipating heat from power regulators or high-end chipsets. ---