The **ATS-03B-75-C3-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and power modules. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Red Anodized | | **Attachment Method** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ## 2. Key Features ### A. Attachment System (Push Pin & Spring) Unlike adhesive-based heat sinks, the **R0** designation indicates a mechanical attachment. * **Brass Push Pins:** Provide a secure and durable mount to the PCB. * **Compression Springs:** Ensure consistent pressure between the heat sink and the component, which is critical for maximizing heat transfer. ### B. Thermal Performance * **Low Profile:** At only 10mm high, it is ideal for space-constrained enclosures (1U servers or small form factor devices). * **Thermal Resistance:** It is designed to work with directed airflow. The efficiency increases significantly as the CFM (Cubic Feet per Minute) of the system fan increases. ### C. Thermal Interface Material (T412) The unit comes with **T412** pre-applied to the base. * **Benefit:** This eliminates the need for manual paste application. * **Performance:** T412 is a high-performance phase-change material that offers low thermal impedance and fills microscopic air gaps. --- ## 3. Physical Dimensions (mm) | Dimension | Value | | :--- | :--- | | **Length (A)** | 45.0 mm | | **Width (B)** | 45.0 mm | | **Height (C)** | 10.0 mm | | **Pin Spread (E)** | 38.0 mm | --- ## 4. Typical Applications * **Network Switches:** Cooling ASICs and high-speed processors. * **Industrial PCs:** Cooling embedded chipsets. * **Power Electronics:** Managing heat for VRMs (Voltage Regulator Modules).