The **ATS-03B-01-C2-R0** is a specific electronic component belonging to the thermal management category. It is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin style, and thermal interface material. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ Heat Sink | | **Material** | Aluminum (AL6063) | | **Attachment Method** | pushPIN™ (Spring-loaded attachment) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | ~4.24°C/W (at 100 LFM) | | **Dimensions** | 40mm x 40mm x 10mm | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T766 (High Performance) | --- ### 2. Breakdown of the Component Parts The "electronic part" is actually an assembly of several mechanical components designed to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs: 1. **Heat Sink Body:** The 40mm aluminum block with vertical straight fins. The fins increase the surface area, allowing air to carry heat away from the component. 2. **Spring-Loaded pushPIN™:** Instead of using adhesive tape or screws, this uses a spring-loaded mechanism that provides consistent pressure (clip-on style). This ensures optimal contact with the electronic chip. 3. **Compression Springs:** These are integrated into the pins to provide a specific "sink-to-chip" force, preventing damage to the silicon while maintaining thermal conductivity. 4. **Thermal Interface Material (T766):** Pre-applied to the base, this is a conductive pad/paste that fills microscopic air gaps between the chip surface and the heat sink. --- ### 3. Usage Context This part is typically found in: * **Networking Hardware:** Routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling voltage regulators or MOSFETs. ---