The **ATS-02F-75-C3-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and electronic application characteristics. ### 1. Technical Specifications The part belongs to the **pushPIN™** series by Advanced Thermal Solutions (ATS). | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded bolts) | | **Thermal Resistance (LFM 200)** | 15.00 °C/W | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 30.00mm | | **Fin Style** | Fine Pitch (Straight) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Key Components & Construction The "electronic" functionality of this part relies on its physical geometry and material properties to dissipate heat generated by semiconductor junctions. * **Heat Sink Body:** Square 25mm footprint, ideal for small processors, FPGAs, or power regulators. The 30mm height provides a large surface area for vertical air dissipation. * **Push-Pin Mounting:** Unlike adhesive-based heatsinks, this uses a mechanical push-pin system. This ensures constant pressure against the chip, which is critical for maintaining a stable thermal bridge. * **T412 Thermal Interface:** The bottom of the heatsink comes with a pre-applied phase-change material. This fills the microscopic air gaps between the component and the metal, significantly lowering thermal resistance. --- ### 3. Part Number Decoder Understanding the nomenclature helps in selecting the correct electronic cooling profile: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **02** | pushPIN™ Series | | **F** | Fine pitch fin pattern | | **75** | Specific dimension/geometry code | | **C3** | Blue Anodized finish | | **R0** | RoHS compliant / Revision | --- ### 4. Application in Circuits This part is typically used in the following electronic environments: 1. **Telecommunications:** Cooling small-form-factor pluggable modules. 2. **Embedded Systems:** Protecting microcontrollers from thermal throttling. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators in tight spaces.