The **ATS-02F-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure they operate within safe temperature limits. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 6.69°C/W (at 100 LFM) | | **Base Dimensions** | 45mm x 45mm | | **Height** | 30mm | --- ### 2. Physical Design Features The part utilizes a specific architectural design to maximize cooling efficiency: * **Straight Fin Pattern:** The vertical fins are arranged to allow airflow to pass through easily, which is ideal for systems with directed air movement (active cooling). * **Push-Pin Mounting:** This part uses a specialized "push-pin" attachment mechanism. It involves a spring-loaded pin that snaps into pre-drilled holes on a Printed Circuit Board (PCB), providing consistent pressure for better thermal contact. * **Blue Anodized Coating:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves surface emissivity for heat radiation. --- ### 3. Thermal Performance (Deg C/W) Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity | 100 LFM | 300 LFM | 500 LFM | | :--- | :--- | :--- | :--- | | **Thermal Resistance** | 6.69 | 2.50 | 1.74 | --- ### 4. Components in the Assembly * **Heatsink Body:** The aluminum structure that conducts heat away from the chip. * **Springs:** Provides the necessary force to keep the heatsink flush against the component. * **Push-Pins:** Brass or plastic pins that lock the assembly to the PCB. * **Thermal Interface Material (TIM):** Usually pre-applied to the bottom to fill microscopic air gaps between the heatsink and the electronic chip. ---