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  • ATS-02B-159-C1-R0

  • AI
    The part number **ATS-02B-159-C1-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their *push-pin* series, designed for cooling electronic components like CPUs, GPUs, or high-power ASICs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm | | **Height** | 10mm (Low Profile) | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the product's attributes: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **02B**: Push-pin attachment series with specific spring forces. * **159**: Refers to the specific thermal performance and dimensions of the heat sink body. * **C1**: Denotes the color/finish (Blue Anodized). * **R0**: Revision code or packaging indicator. --- ### 3. Key Electronic Functions While the heat sink itself is mechanical, it is critical for the stability of electronic systems: 1. **Thermal Management**: It increases the surface area of a heat-generating component, allowing heat to dissipate into the surrounding air via convection. 2. **Thermal Interface Material (T766)**: This part comes with a pre-applied phase-change material. This fills microscopic air gaps between the chip and the heat sink, significantly reducing thermal resistance. 3. **EMI Shielding**: In some configurations, a grounded metal heat sink can assist in reducing Electromagnetic Interference (EMI) from high-frequency processors. --- ### 4. Component Comparison (Airflow) Thermal resistance varies based on the velocity of the air moving through the fins: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 10.68 | | 400 (2.0 m/s) | 4.47 | | 600 (3.0 m/s) | 3.67 | ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the push-pin mounting of this heat sink?
    • ⤷ Is the T766 thermal interface material electrically conductive?
    • ⤷ What is the weight of the ATS-02B-159-C1-R0?