ATS-02B-159-C1-R0
AI

The part number **ATS-02B-159-C1-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their *push-pin* series, designed for cooling electronic components like CPUs, GPUs, or high-power ASICs.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions** | 45mm x 45mm |
| **Height** | 10mm (Low Profile) |
| **Fin Style** | Straight Fin |
| **Attachment Method** | Push-Pin (Plastic) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Breakdown of the Part Number
The part number follows a specific nomenclature used by ATS to identify the product's attributes:
* **ATS**: Manufacturer (Advanced Thermal Solutions).
* **02B**: Push-pin attachment series with specific spring forces.
* **159**: Refers to the specific thermal performance and dimensions of the heat sink body.
* **C1**: Denotes the color/finish (Blue Anodized).
* **R0**: Revision code or packaging indicator.
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### 3. Key Electronic Functions
While the heat sink itself is mechanical, it is critical for the stability of electronic systems:
1. **Thermal Management**: It increases the surface area of a heat-generating component, allowing heat to dissipate into the surrounding air via convection.
2. **Thermal Interface Material (T766)**: This part comes with a pre-applied phase-change material. This fills microscopic air gaps between the chip and the heat sink, significantly reducing thermal resistance.
3. **EMI Shielding**: In some configurations, a grounded metal heat sink can assist in reducing Electromagnetic Interference (EMI) from high-frequency processors.
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### 4. Component Comparison (Airflow)
Thermal resistance varies based on the velocity of the air moving through the fins:
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 200 (1.0 m/s) | 10.68 |
| 400 (2.0 m/s) | 4.47 |
| 600 (3.0 m/s) | 3.67 |
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- ⤷
What are the PCB hole requirements for the push-pin mounting of this heat sink?
- ⤷ Is the T766 thermal interface material electrically conductive?
- ⤷ What is the weight of the ATS-02B-159-C1-R0?