ATS-02A-85-C2-R0
AI

The **ATS-02A-85-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits on a PCB.
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### 1. Technical Specifications
The following table summarizes the physical and thermal characteristics of the part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm |
| **Attachment Method** | Push-Pin (Brass) |
| **Spring Type** | Compression Spring |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Thermal Performance
Thermal resistance defines how efficiently the heat sink moves heat away from the component into the surrounding air. The performance varies based on air velocity (LFM - Linear Feet per Minute):
* **Unducted Flow (1.0 m/s):** ~24.00 °C/W
* **Ducted Flow:** Provides significantly lower resistance under forced air cooling.
* **Heat Sink Profile:** It features a **Straight Fin** design, which is optimal for directional airflow environments.
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### 3. Electronic Component Features
The "electronic" value of this part lies in its mechanical integration and material science:
#### A. Attachment System (Push-Pins)
Unlike adhesive-based heat sinks, the **ATS-02A-85-C2-R0** uses a mechanical push-pin system.
* **Benefits:** Ensures consistent pressure on the component, improving heat transfer.
* **Reliability:** It prevents the heat sink from shifting or falling off during high-vibration scenarios (common in industrial electronics).
#### B. Thermal Interface Material (T766)
The base comes pre-applied with **T766 phase-change material**.
* **Function:** It fills the microscopic air gaps between the chip surface and the aluminum base.
* **Efficiency:** This reduces the "Contact Resistance," which is often the biggest bottleneck in cooling electronic parts.
#### C. Anodized Coating
The **Blue Anodized** finish is not just for aesthetics.
* **Protection:** It provides a thin layer of electrical insulation and protects the aluminum from corrosion.
* **Emissivity:** Anodized surfaces have higher emissivity than polished aluminum, slightly improving radiant heat transfer.
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### 4. Common Applications
* **Embedded Systems:** Cooling microprocessors in compact enclosures.
* **Networking Gear:** Cooling ASICs in switches and routers.
* **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.
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What are the PCB hole requirements for the push-pin mounting of this heat sink?
- ⤷ How does the T766 thermal material compare to standard thermal paste?
- ⤷ Is there a version of this heat sink with a different height profile for low-clearance cases?