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  • ATS-02A-85-C2-R0

  • AI
    The **ATS-02A-85-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits on a PCB. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Thermal Performance Thermal resistance defines how efficiently the heat sink moves heat away from the component into the surrounding air. The performance varies based on air velocity (LFM - Linear Feet per Minute): * **Unducted Flow (1.0 m/s):** ~24.00 °C/W * **Ducted Flow:** Provides significantly lower resistance under forced air cooling. * **Heat Sink Profile:** It features a **Straight Fin** design, which is optimal for directional airflow environments. --- ### 3. Electronic Component Features The "electronic" value of this part lies in its mechanical integration and material science: #### A. Attachment System (Push-Pins) Unlike adhesive-based heat sinks, the **ATS-02A-85-C2-R0** uses a mechanical push-pin system. * **Benefits:** Ensures consistent pressure on the component, improving heat transfer. * **Reliability:** It prevents the heat sink from shifting or falling off during high-vibration scenarios (common in industrial electronics). #### B. Thermal Interface Material (T766) The base comes pre-applied with **T766 phase-change material**. * **Function:** It fills the microscopic air gaps between the chip surface and the aluminum base. * **Efficiency:** This reduces the "Contact Resistance," which is often the biggest bottleneck in cooling electronic parts. #### C. Anodized Coating The **Blue Anodized** finish is not just for aesthetics. * **Protection:** It provides a thin layer of electrical insulation and protects the aluminum from corrosion. * **Emissivity:** Anodized surfaces have higher emissivity than polished aluminum, slightly improving radiant heat transfer. --- ### 4. Common Applications * **Embedded Systems:** Cooling microprocessors in compact enclosures. * **Networking Gear:** Cooling ASICs in switches and routers. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the push-pin mounting of this heat sink?
    • ⤷ How does the T766 thermal material compare to standard thermal paste?
    • ⤷ Is there a version of this heat sink with a different height profile for low-clearance cases?