The **ATS-02A-84-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 30mm x 30mm x 35mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 1.62°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Engineering Features ### A. Fin Geometry (Straight Fin) This heat sink utilizes a **straight-fin design**, which is optimized for high-velocity airflow environments. The vertical fins provide a large surface area to dissipate heat as air flows through the channels. ### B. Push-Pin Attachment The model number includes "02A," which refers to the specific attachment mechanism: * **Ease of Install:** Uses plastic push pins with a built-in spring. * **Pressure Control:** The spring ensures consistent downward pressure on the electronic component, maximizing thermal transfer efficiency. * **Hole Pattern:** Requires pre-drilled holes in the PCB. ### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied. This is a phase-change material that fills microscopic air gaps between the heat sink and the electronic chip, significantly lowering the contact resistance. --- ### 3. Thermal Performance Analysis The performance of the ATS-02A-84-C2-R0 is dependent on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 LFM | 1.62 | | 300 LFM | 1.15 | | 400 LFM | 0.96 | | 500 LFM | 0.85 | --- ### 4. Typical Applications * **BGA Components:** Ball Grid Array cooling for networking equipment. * **Power Electronics:** Cooling MOSFETs or voltage regulators. * **Embedded Systems:** Industrial PCs where high-height (35mm) clearance is available. ---