ATS-02A-83-C2-R0
AI

The **ATS-02A-83-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors.
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### 1. Technical Specifications
The following table highlights the core physical and thermal properties of this specific part:
| Property | Value / Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Attachment Method** | Push-Pin |
| **Fin Style** | Straight |
| **Base Dimensions** | 30mm x 30mm |
| **Height (Off Base)** | 20mm |
| **Thermal Resistance** | 16.03°C/W (at 100 LFM) |
| **Finish** | Blue Anodized |
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### 2. Key Design Features
The ATS-02A-83-C2-R0 incorporates several engineering features to optimize cooling efficiency:
* **pushPIN™ Attachment:** It utilizes a specialized spring-loaded mechanism (Push-Pin) that ensures high pressure against the component, improving thermal interface contact.
* **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance thermal grease or pad to bridge the air gap between the chip and the aluminum.
* **Optimized Fin Pitch:** The straight-fin design is engineered for specific airflow environments, allowing air to pass through with minimal pressure drop while maximizing surface area.
* **Blue Anodized Finish:** This is not just aesthetic; the anodization protects the aluminum from corrosion and slightly increases emissivity.
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### 3. Application Use Cases
This heat sink is categorized as a "Small Form Factor" cooling solution, making it ideal for:
1. **Networking Hardware:** Routers, switches, and small server modules.
2. **Embedded Systems:** Industrial PCs and IoT gateways.
3. **Power Electronics:** Voltage regulators and motor drivers that generate localized heat.
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### 4. Mounting Hole Compatibility
When designing a PCB for this part, the mounting holes must align with the Push-Pin layout:
```text
Hole Pitch (Standard): 35.0mm (approximate center-to-center)
Hole Diameter: Typically 3.0mm to 3.2mm
```
- ⤷
What is the thermal resistance of this heat sink at high airflow (500 LFM)?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?
- ⤷ Are there alternative mounting options if push-pins are not compatible with my PCB?