công cụ tìm kiếm bảng dữ liệu linh kiện điện tử
  Vietnamese  ▼
ALLDATASHEET.VN

X  

  • ATS-02A-83-C2-R0

  • AI
    The **ATS-02A-83-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this specific part: | Property | Value / Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Method** | Push-Pin | | **Fin Style** | Straight | | **Base Dimensions** | 30mm x 30mm | | **Height (Off Base)** | 20mm | | **Thermal Resistance** | 16.03°C/W (at 100 LFM) | | **Finish** | Blue Anodized | --- ### 2. Key Design Features The ATS-02A-83-C2-R0 incorporates several engineering features to optimize cooling efficiency: * **pushPIN™ Attachment:** It utilizes a specialized spring-loaded mechanism (Push-Pin) that ensures high pressure against the component, improving thermal interface contact. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance thermal grease or pad to bridge the air gap between the chip and the aluminum. * **Optimized Fin Pitch:** The straight-fin design is engineered for specific airflow environments, allowing air to pass through with minimal pressure drop while maximizing surface area. * **Blue Anodized Finish:** This is not just aesthetic; the anodization protects the aluminum from corrosion and slightly increases emissivity. --- ### 3. Application Use Cases This heat sink is categorized as a "Small Form Factor" cooling solution, making it ideal for: 1. **Networking Hardware:** Routers, switches, and small server modules. 2. **Embedded Systems:** Industrial PCs and IoT gateways. 3. **Power Electronics:** Voltage regulators and motor drivers that generate localized heat. --- ### 4. Mounting Hole Compatibility When designing a PCB for this part, the mounting holes must align with the Push-Pin layout: ```text Hole Pitch (Standard): 35.0mm (approximate center-to-center) Hole Diameter: Typically 3.0mm to 3.2mm ```
    ✨ Follow-up Questions
    • ⤷ What is the thermal resistance of this heat sink at high airflow (500 LFM)?
    • ⤷ How does the T766 thermal interface material compare to standard thermal paste?
    • ⤷ Are there alternative mounting options if push-pins are not compatible with my PCB?