ATS-02A-53-C2-R0
AI

The **ATS-02A-53-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" attachment series designed for cooling electronic components like CPUs, GPUs, or high-power transistors.
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## 1. Technical Specifications
The following table outlines the physical and thermal characteristics of the part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum (with Blue Anodized Finish) |
| **Dimensions** | 35.00mm x 35.00mm |
| **Height** | 15.00mm |
| **Fin Style** | Straight (optimized for airflow) |
| **Attachment Type** | Push-Pin (Plastic or Brass) |
| **Spring Type** | Compression Spring |
| **Thermal Interface** | T766 (Pre-applied Phase Change Material) |
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## 2. Key Electronic Functions
While the heat sink itself does not carry current, it is a critical "passive" component in electronic design for the following reasons:
### Thermal Management
* **Dissipation:** It increases the surface area of a semiconductor package, allowing heat to transfer from the silicon die to the ambient air more efficiently.
* **Reliability:** By maintaining a lower junction temperature ($T_j$), it prevents thermal throttling and extends the mean time between failures (MTBF) of the electronic device.
### Mechanical Attachment (Push-Pin)
* The "R0" designation refers to the specific attachment kit.
* **Force:** The integrated springs apply a precise amount of downward pressure to ensure the Thermal Interface Material (TIM) fills microscopic gaps between the chip and the heat sink.
* **Installation:** It requires pre-drilled holes in the PCB, usually spaced at specific intervals (e.g., 20mm or 32mm depending on the exact sub-model).
### Thermal Interface Material (T766)
* The unit comes with **T766** pre-applied. This is a "Phase Change Material" (PCM) that softens when the electronic part heats up, ensuring a low thermal resistance path between the chip and the aluminum fins.
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## 3. Thermal Performance Metrics
The effectiveness of this part depends on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **200 LFM** | ~4.50 °C/W |
| **400 LFM** | ~3.10 °C/W |
| **600 LFM** | ~2.50 °C/W |
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## 4. Summary of Part Number Coding
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **02A:** Product Series / Geometry.
* **53:** Fin height and density configuration.
* **C2:** Blue Anodized finish (improves radiation and corrosion resistance).
* **R0:** Standard packaging and attachment hardware.
- ⤷
What is the hole-to-hole spacing required on the PCB for this heat sink?
- ⤷ Can this heat sink be used without a fan (passive cooling)?
- ⤷ What are the alternatives to push-pin mounting for this size?