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  • ATS-02A-53-C2-R0

  • AI
    The **ATS-02A-53-C2-R0** is a specific part number for a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" attachment series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (with Blue Anodized Finish) | | **Dimensions** | 35.00mm x 35.00mm | | **Height** | 15.00mm | | **Fin Style** | Straight (optimized for airflow) | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface** | T766 (Pre-applied Phase Change Material) | --- ## 2. Key Electronic Functions While the heat sink itself does not carry current, it is a critical "passive" component in electronic design for the following reasons: ### Thermal Management * **Dissipation:** It increases the surface area of a semiconductor package, allowing heat to transfer from the silicon die to the ambient air more efficiently. * **Reliability:** By maintaining a lower junction temperature ($T_j$), it prevents thermal throttling and extends the mean time between failures (MTBF) of the electronic device. ### Mechanical Attachment (Push-Pin) * The "R0" designation refers to the specific attachment kit. * **Force:** The integrated springs apply a precise amount of downward pressure to ensure the Thermal Interface Material (TIM) fills microscopic gaps between the chip and the heat sink. * **Installation:** It requires pre-drilled holes in the PCB, usually spaced at specific intervals (e.g., 20mm or 32mm depending on the exact sub-model). ### Thermal Interface Material (T766) * The unit comes with **T766** pre-applied. This is a "Phase Change Material" (PCM) that softens when the electronic part heats up, ensuring a low thermal resistance path between the chip and the aluminum fins. --- ## 3. Thermal Performance Metrics The effectiveness of this part depends on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 LFM** | ~4.50 °C/W | | **400 LFM** | ~3.10 °C/W | | **600 LFM** | ~2.50 °C/W | --- ## 4. Summary of Part Number Coding * **ATS:** Advanced Thermal Solutions (Manufacturer). * **02A:** Product Series / Geometry. * **53:** Fin height and density configuration. * **C2:** Blue Anodized finish (improves radiation and corrosion resistance). * **R0:** Standard packaging and attachment hardware.
    ✨ Follow-up Questions
    • ⤷ What is the hole-to-hole spacing required on the PCB for this heat sink?
    • ⤷ Can this heat sink be used without a fan (passive cooling)?
    • ⤷ What are the alternatives to push-pin mounting for this size?