The part number **ATS-02A-182-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Attachment Method** | Push Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 7.51°C/W (at 100 LFM) | | **Fin Style** | Straight Fin | --- ## 2. Component Breakdown ### A. Material and Coating * **Aluminum:** Provides a lightweight structure with high thermal conductivity. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves surface emissivity for better radiant heat transfer. ### B. The Push Pin Attachment This part uses a mechanical attachment system rather than thermal adhesive: * **Reliability:** Mechanical pins provide consistent pressure between the heat sink and the chip. * **Pre-drilled Holes:** This requires the Printed Circuit Board (PCB) to have specific mounting holes spaced to match the pins. * **Springs:** The springs ensure that as the PCB expands or contracts due to heat, the contact pressure remains constant. ### C. Thermal Interface Material (TIM) The "R0" suffix typically indicates that the heat sink comes with a **pre-applied Thermal Interface Material**. This fills the microscopic air gaps between the component and the heat sink to ensure maximum heat flow. --- ## 3. Performance Data (Airflow) Thermal resistance varies based on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100** | 7.51 | | **200** | 4.15 | | **300** | 3.32 | | **400** | 2.86 | --- ## 4. Common Applications * **BGA Cooling:** Ball Grid Array chips that generate moderate heat. * **Telecommunications:** Networking gear and routers. * **Power Supplies:** Cooling voltage regulators and power transistors.