ATS-02A-129-C2-R0
AI

The part number **ATS-02A-129-C2-R0** refers to a high-performance **Heatsink** manufactured by *Advanced Thermal Solutions (ATS)*. This specific component is part of the "pushPIN™" family of thermal management solutions.
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### 1. Technical Specifications
Below are the primary technical parameters for this component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Base Part Number** | ATS-02A-129 |
| **Heat Sink Type** | XCUT (Cross-Cut) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring Loaded) |
| **Thermal Resistance** | 8.68°C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 60.00mm x 60.00mm x 10.00mm |
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### 2. Breakdown of the Part Number
The part number follows a specific nomenclature used by ATS to describe the physical and thermal properties:
* **ATS**: Manufacturer (Advanced Thermal Solutions).
* **02**: Thermal resistance series code.
* **A**: Version/Material indicator.
* **129**: Specific geometry and fin density code.
* **C2**: Thermal Interface Material (TIM) and finish. "C2" typically denotes **T766 Phase Change Material** and a Blue Anodized finish.
* **R0**: Revision/Packaging code.
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### 3. Key Electronic Design Features
* **XCUT Fin Pattern:** The cross-cut design allows for multidirectional airflow. This is critical in electronics enclosures where the direction of the cooling fan's exhaust might not be perfectly aligned with the heatsink fins.
* **PushPIN™ Attachment:** Instead of messy adhesives, this uses a spring-loaded mechanism. This ensures constant, uniform pressure (load) on the high-power electronic component (like a CPU, GPU, or FPGA), which optimizes heat transfer.
* **T766 TIM:** The pre-applied thermal interface material ensures low thermal resistance between the semiconductor surface and the aluminum base without requiring manual paste application.
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### 4. Thermal Performance
Thermal resistance varies based on the Airflow (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 8.68 |
| 200 | 1.0 | 4.02 |
| 400 | 2.0 | 2.39 |
| 600 | 3.0 | 1.85 |
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What are the mounting hole requirements for the pushPIN system?
- ⤷ Can this heatsink be used on components smaller than 60x60mm?
- ⤷ What are the benefits of the 'Blue Anodized' finish in electronics?