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  • ATS-02A-129-C2-R0

  • AI
    The part number **ATS-02A-129-C2-R0** refers to a high-performance **Heatsink** manufactured by *Advanced Thermal Solutions (ATS)*. This specific component is part of the "pushPIN™" family of thermal management solutions. --- ### 1. Technical Specifications Below are the primary technical parameters for this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Part Number** | ATS-02A-129 | | **Heat Sink Type** | XCUT (Cross-Cut) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring Loaded) | | **Thermal Resistance** | 8.68°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 60.00mm x 60.00mm x 10.00mm | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to describe the physical and thermal properties: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **02**: Thermal resistance series code. * **A**: Version/Material indicator. * **129**: Specific geometry and fin density code. * **C2**: Thermal Interface Material (TIM) and finish. "C2" typically denotes **T766 Phase Change Material** and a Blue Anodized finish. * **R0**: Revision/Packaging code. --- ### 3. Key Electronic Design Features * **XCUT Fin Pattern:** The cross-cut design allows for multidirectional airflow. This is critical in electronics enclosures where the direction of the cooling fan's exhaust might not be perfectly aligned with the heatsink fins. * **PushPIN™ Attachment:** Instead of messy adhesives, this uses a spring-loaded mechanism. This ensures constant, uniform pressure (load) on the high-power electronic component (like a CPU, GPU, or FPGA), which optimizes heat transfer. * **T766 TIM:** The pre-applied thermal interface material ensures low thermal resistance between the semiconductor surface and the aluminum base without requiring manual paste application. --- ### 4. Thermal Performance Thermal resistance varies based on the Airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 8.68 | | 200 | 1.0 | 4.02 | | 400 | 2.0 | 2.39 | | 600 | 3.0 | 1.85 |
    ✨ Follow-up Questions
    • ⤷ What are the mounting hole requirements for the pushPIN system?
    • ⤷ Can this heatsink be used on components smaller than 60x60mm?
    • ⤷ What are the benefits of the 'Blue Anodized' finish in electronics?