The **ATS-02A-101-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Key Technical Specifications The part is characterized by its physical dimensions and thermal efficiency. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 30mm | | **Attachment Type** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 6.77° C/W (@ 100 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Breakdown of the Model Number The part number follows a specific logic used by Advanced Thermal Solutions: * **ATS:** Prefix for Advanced Thermal Solutions. * **02A:** Refers to the specific series and mounting hardware configuration. * **101:** Indicates the physical size and fin density configuration. * **C3:** Refers to the **Thermal Interface Material (TIM)** provided. C3 usually indicates that a high-performance thermal pad or pre-applied phase-change material is included. * **R0:** Revision code (standard release). --- ### 3. Electronic Design Benefits * **Thermal Management:** The 30mm height allows for significant surface area, which is critical for dissipating heat from power-dense components. * **Push Pin Mounting:** This design uses a spring-loaded mechanism that provides consistent pressure on the chip, ensuring maximum thermal transfer and reducing the risk of the heat sink shifting during vibration. * **Airflow Optimization:** The straight fin design is optimized for environments with consistent directional airflow (forced convection). --- ### 4. Typical Applications This heat sink is commonly found in: * Network switches and routers. * Embedded computing systems. * Industrial power supplies. * Telecommunications equipment.