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  • ATS-02A-08-C3-R0

  • AI
    The **ATS-02A-08-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for precision cooling of integrated circuits (ICs) and other electronic components. ### 1. Key Technical Specifications The following table outlines the mechanical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Fin Style** | Straight Fin | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height (Height Off Base)** | 17.52 mm | | **Pitch (Mounting)** | 38.00 mm | --- ### 2. Electronic Thermal Performance Thermal resistance is measured in °C/W (Celsius per Watt), indicating how effectively the part dissipates heat away from the silicon die. * **Unducted Flow (Natural Airflow):** ~14.61 °C/W @ 100 LFM. * **Ducted Flow (Forced Airflow):** ~2.33 °C/W @ 100 LFM. * **Optimal Range:** It is highly efficient in environments with forced convection (fans), significantly lowering the junction temperature of the component it covers. --- ### 3. Design Components The "Electronic" assembly of this part consists of three primary elements: 1. **The Heat Sink Body:** Extruded aluminum with a specific fin density designed to maximize surface area contact with the air. 2. **Thermal Interface Material (TIM):** This part usually comes with **T412** or similar pre-applied phase-change material to fill microscopic air gaps between the heat sink and the chip. 3. **Push-Pin Mechanism:** Uses a compression spring to provide precise "Firm" pressure (measured in PSI) across the component, ensuring uniform thermal contact without cracking the PCB or the chip. --- ### 4. Part Number Breakdown (Nomenclature) Understanding the code `ATS-02A-08-C3-R0`: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions | | **02** | Series/Geometry Identifier | | **A** | Push-pin style/version | | **08** | Specific height/fin configuration | | **C3** | Thermal Interface Material (TIM) and Color code | | **R0** | Revision/RoHS Compliant status |
    ✨ Follow-up Questions
    • ⤷ What are the compatible PCB hole sizes for the push-pin mounting on this heat sink?
    • ⤷ How does the T412 thermal interface material compare to standard thermal grease?
    • ⤷ Can this heat sink be used on BGA or LGA processor packages?