ATS-02A-08-C3-R0
AI

The **ATS-02A-08-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for precision cooling of integrated circuits (ICs) and other electronic components.
### 1. Key Technical Specifications
The following table outlines the mechanical and thermal characteristics of the part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | Push-Pin (Plastic/Brass) |
| **Fin Style** | Straight Fin |
| **Dimensions (L x W)** | 45.00 mm x 45.00 mm |
| **Height (Height Off Base)** | 17.52 mm |
| **Pitch (Mounting)** | 38.00 mm |
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### 2. Electronic Thermal Performance
Thermal resistance is measured in °C/W (Celsius per Watt), indicating how effectively the part dissipates heat away from the silicon die.
* **Unducted Flow (Natural Airflow):** ~14.61 °C/W @ 100 LFM.
* **Ducted Flow (Forced Airflow):** ~2.33 °C/W @ 100 LFM.
* **Optimal Range:** It is highly efficient in environments with forced convection (fans), significantly lowering the junction temperature of the component it covers.
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### 3. Design Components
The "Electronic" assembly of this part consists of three primary elements:
1. **The Heat Sink Body:** Extruded aluminum with a specific fin density designed to maximize surface area contact with the air.
2. **Thermal Interface Material (TIM):** This part usually comes with **T412** or similar pre-applied phase-change material to fill microscopic air gaps between the heat sink and the chip.
3. **Push-Pin Mechanism:** Uses a compression spring to provide precise "Firm" pressure (measured in PSI) across the component, ensuring uniform thermal contact without cracking the PCB or the chip.
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### 4. Part Number Breakdown (Nomenclature)
Understanding the code `ATS-02A-08-C3-R0`:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions |
| **02** | Series/Geometry Identifier |
| **A** | Push-pin style/version |
| **08** | Specific height/fin configuration |
| **C3** | Thermal Interface Material (TIM) and Color code |
| **R0** | Revision/RoHS Compliant status |
- ⤷
What are the compatible PCB hole sizes for the push-pin mounting on this heat sink?
- ⤷ How does the T412 thermal interface material compare to standard thermal grease?
- ⤷ Can this heat sink be used on BGA or LGA processor packages?