The **ATS-01H-89-C2-R0** is a specific electronic component primarily classified as a **High-Performance Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to their "blue ice" or high-efficiency push-pin heat sink series. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-01H-89-C2-R0 | | **Heat Sink Type** | Push-Pin (Aluminum) | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 20.00mm | | **Thermal Resistance** | 3.94°C/W (@ 100 LFM) | | **Material** | Aluminum 6063 | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Functional Electronic Parts While the unit is mechanical, its "parts" are engineered to interact with electronic systems in specific ways: #### A. The Heat Sink Body (Base & Fins) * **Material:** Made of Aluminum 6063 for high thermal conductivity. * **Design:** The straight-fin design is optimized for **forced air cooling** (airflow from fans). The base is machined flat to ensure maximum surface contact with the electronic chip (CPU, GPU, or MOSFET). #### B. The Push-Pin Fasteners * **Mechanism:** These are plastic pins with internal springs. * **Purpose:** They provide a standardized **attachment force** (pressure) to ensure the heat sink remains in constant contact with the component despite vibrations or thermal expansion. * **Hole Pattern:** Designed for specific PCB hole spacing (30mm x 30mm center-to-center). #### C. Thermal Interface Material (TIM) * **Component:** The "C2" in the part number indicates the specific TIM used. * **Role:** This is a pre-applied layer of thermal grease/pad on the bottom of the sink. It fills microscopic air gaps between the heat sink and the electronic chip to facilitate heat transfer. --- ### 3. Application Use Cases This part is typically used to cool mid-range electronic components that generate significant heat during operation: * **Application Specific Integrated Circuits (ASICs)** * **Field Programmable Gate Arrays (FPGAs)** * **Power Converters** * **Microprocessors in industrial PC environments** ---