The **ATS-01H-75-C3-R0** is a specific electronic cooling component known as a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to their "pushPIN™" series of high-performance thermal management solutions. --- ### 1. Technical Specifications The following table highlights the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 25mm x 25mm x 20mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Cross-Cut (Square-pin) | | **Thermal Resistance** | ~15.29 °C/W (at 100 LFM) | | **Flow Orientation** | Omnidirectional (All directions) | --- ### 2. Key Component Features #### A. Cross-Cut Fin Design Unlike straight-fin heat sinks, the cross-cut (or square-pin) design allows air to flow through the heat sink from any direction. This makes it ideal for electronics where the airflow path is unpredictable or obstructed by other components. #### B. pushPIN™ Attachment The "pushPIN" system consists of a brass or plastic pin with a compressed spring. * **Advantage:** It provides a precise, consistent pressure across the thermal interface material (TIM). * **Stability:** It ensures the heat sink remains securely attached to the PCB even during shipping or vibration. #### C. Thermal Interface Material (TIM) The "C3" in the part number indicates that the heat sink comes pre-applied with a **Phase Change Material (T766)**. This material fills the microscopic gaps between the heat sink and the electronic component (CPU, GPU, or MOSFET) to maximize heat transfer. --- ### 3. Application Use Cases This part is typically used for cooling small, high-heat electronic packages such as: 1. **Microprocessors and FPGAs:** In embedded systems. 2. **Power Supplies:** Cooling voltage regulators. 3. **Telecommunications:** High-speed data networking equipment. ---