The **ATS-01H-65-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is designed for the thermal management of electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (typically with Blue Anodized finish) | | **Thermal Resistance** | 7.29°C/W (at 200 LFM air flow) | | **Attachment Method** | pushPIN™ (Spring-loaded attachment) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Fin Style** | Straight Fin | --- ### 2. Key Design Features * **Thermal Performance:** This heatsink is designed for forced convection (active cooling). The straight-fin design allows for high air throughput, reducing the temperature of the underlying semiconductor. * **pushPIN™ Attachment:** Unlike adhesive tapes, this model uses a mechanical spring-loaded pin system. This provides: * **Consistent Pressure:** Ensures optimal thermal interface material (TIM) contact. * **Secure Mounting:** Resistant to shocks and vibrations. * **Blue Anodized Coating:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly increases surface emissivity for better radiant heat transfer. --- ### 3. Application Use-Cases The ATS-01H-65-C2-R0 is commonly used in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed network processors and FPGA chips. 2. **Industrial PCs:** Thermal management for embedded systems operating in high-heat environments. 3. **Power Electronics:** Dissipating heat from Voltage Regulator Modules (VRMs) or power converters. --- ### 4. Installation Considerations To use this part effectively, engineers must consider: * **PCB Hole Pattern:** The PCB must have pre-drilled holes to accommodate the pushPIN™ pitch (distance between pins). * **Thermal Interface Material (TIM):** A thermal pad or paste must be applied between the chip and the heatsink base to eliminate air gaps. * **Airflow Direction:** Straight fins are most efficient when the airflow is parallel to the fins.