The **ATS-01H-41-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed for electronic components requiring efficient thermal management, such as CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications Below are the primary mechanical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 10.02° C/W @ 100 LFM | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 30.00mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Features * **push-pin Attachment:** The part utilizes a standardized push-pin mounting system with a compression spring. This ensures consistent pressure across the component for optimal heat transfer and prevents accidental detachment. * **High Aspect Ratio Fins:** The "straight fin" design provides a high surface area-to-volume ratio, which is ideal for forced convection (airflow) cooling environments. * **Blue Anodized Finish:** The surface treatment improves thermal radiation properties and provides corrosion resistance. * **Pre-Applied TIM:** It comes with **T766 thermal interface material**, which fills microscopic air gaps between the heat sink base and the electronic chip, reducing contact resistance. --- ### 3. Application Use Cases This specific heat sink size (25mm x 25mm) is commonly used for: 1. **Networking Hardware:** High-speed routers, switches, and modems. 2. **Embedded Systems:** Industrial PCs and single-board computers. 3. **Power Management:** Regulators and high-power MOSFETs that generate localized heat. 4. **Integrated Circuits:** BGA (Ball Grid Array) or FPGA chips that require active or passive cooling. ---