The **ATS-01H-101-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). While it is not an "electronic part" in the sense of a semiconductor (like a transistor or IC), it is a critical **thermal management component** used to dissipate heat from electronic devices. Below is the technical breakdown of its parts and specifications: --- ### 1. Technical Specifications | Feature | Detail | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 6.69°C/W (at 100 LFM) | | **Dimensions** | 40mm x 40mm x 30mm | | **Weight** | 68 grams | --- ### 2. Key Components & Design * **Fin Profile (Straight Fin):** The "101" series features a straight-fin design. These vertical fins increase surface area, allowing heat to transfer from the metal to the surrounding air via convection. * **Base Plate:** A flat, thick aluminum base that makes direct contact with the heat-generating component (e.g., a CPU, FPGA, or MOSFET). * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a spring-loaded push-pin mechanism. This provides constant pressure (7-10 lbs) for optimal thermal interface contact. * **C2 Material Code:** This indicates the use of **Aluminum 6063**, which offers a balance of high thermal conductivity and structural strength. * **R0 Rating:** This refers to the RoHS (Restriction of Hazardous Substances) compliance, ensuring the part is environmentally safe for global distribution. --- ### 3. Thermal Performance Metrics The effectiveness of this part depends on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 6.69 | | 300 (1.5 m/s) | 2.52 | | 500 (2.5 m/s) | 1.74 | --- ### 4. Application Use-Case This part is typically used in: 1. **Telecommunications:** Cooling high-speed processing chips. 2. **Power Electronics:** Dissipating heat from high-voltage regulators. 3. **Embedded Systems:** Protecting industrial PCs from thermal throttling.