The **ATS-01G-99-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and electronic components. It is manufactured by Advanced Thermal Solutions (ATS) as part of their "push pin" series. --- ### 1. Technical Specifications Below are the primary technical parameters for this component: | Feature | Specification | | :--- | :--- | | **Product Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (with Brass Spring) | | **Thermal Resistance** | 11.55°C/W (Unducted Flow @ 1.0 m/s) | | **Dimensions (L x W)** | 45.00 mm x 45.00 mm | | **Height** | 20.00 mm | | **Pitch** | 38.00 mm (hole-to-hole) | --- ### 2. Key Electronic Features The "electronic" functionality of this part is passive, focusing on heat dissipation to maintain the stability of active components like CPUs, GPUs, or FPGAs. #### A. Thermal Performance The heatsink utilizes a **fine-pitch design** to maximize surface area. As air flows across the fins, heat is transferred from the electronic component through the base and into the ambient air. * **Low Airflow:** High thermal resistance (approx. 11.55°C/W). * **High Airflow:** Thermal resistance drops significantly (approx. 1.71°C/W at 3.5 m/s), indicating it is highly efficient in forced-convection environments. #### B. Attachment Mechanism Unlike adhesive-based heatsinks, the `C2-R0` variant uses a **push pin and spring** system: * **Reliability:** Provides consistent pressure on the electronic package, improving thermal interface material (TIM) performance. * **Security:** Prevents the heatsink from shifting during mechanical shock or vibration, which is critical for industrial electronics. #### C. Thermal Interface Material (TIM) The "R0" suffix typically denotes that the part comes pre-applied with **T766 Phase Change Material** or similar high-performance grease, ensuring immediate, high-efficiency heat transfer from the silicon die to the aluminum. --- ### 3. Dimensional Drawing (Mockup) ```text 45.00 mm (L) <----------------> __________________ ^ | || || || || || || | | 20.00 mm (H) |_||_||_||_||_||_||_| v [Base Plate/TIM] ``` --- ### 4. Typical Applications * **Networking Equipment:** High-speed routers and switches. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Embedded Systems:** Single-board computers (SBCs) that require robust mechanical mounting.