The **ATS-01G-72-C2-R0** is an electronic thermal management component, specifically a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to their "maxiFLOW™" series, designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 45mm x 45mm x 20mm | | **Fin Type** | maxiFLOW™ (Flared Fin) | | **Thermal Resistance** | 2.50°C/W (at 200 LFM) | | **Pressure Drop** | 0.23 (at 200 LFM) | | **Attachment Method** | pushPIN™ | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design and Engineering Features ### A. maxiFLOW™ Fin Geometry The "G" in the part number refers to the flared fin design. Unlike straight fins, flared fins increase the surface area and provide better airflow intake, which significantly improves thermal performance in constrained spaces where airflow is non-linear. ### B. pushPIN™ Attachment The unit utilizes a specialized mechanical attachment system: * **Speed:** Allows for rapid assembly to the PCB. * **Pressure:** Uses a precise spring-loaded mechanism to ensure uniform pressure across the component, optimizing heat transfer through the Thermal Interface Material (TIM). * **Versatility:** Available with different spring strengths and pin materials (plastic or brass). ### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a high-performance phase-change material or grease that fills the microscopic air gaps between the heat sink base and the electronic chip (CPU/GPU/FPGA), lowering the contact resistance. --- ### 3. Electronic Applications This specific heat sink is commonly used for cooling the following electronic components: 1. **FPGAs & ASICs:** High-density chips that generate significant localized heat. 2. **Processors (CPUs/GPUs):** Embedded processors in industrial or telecommunications hardware. 3. **Power Electronics:** High-efficiency power converters requiring compact cooling solutions. --- ### 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer) * **01G:** Part Series (maxiFLOW™ Flared Fin) * **72:** Specific dimension/geometry code * **C2:** Blue Anodized finish * **R0:** Revision/Packaging code