ATS-01G-63-C2-R0
AI

The **ATS-01G-63-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed specifically for electronic components like BGAs (Ball Grid Arrays) to manage heat dissipation in confined spaces.
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## 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions** | 40mm x 40mm x 20mm |
| **Fin Style** | Straight (Push-Pin Design) |
| **Thermal Resistance** | 2.85°C/W @ 1.0 m/s (approx.) |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
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## 2. Key Features
* **Aluminum Construction:** Offers a high thermal conductivity-to-weight ratio, ensuring efficient heat transfer from the semiconductor to the surrounding air.
* **Push-Pin Attachment:** Features a reliable mounting mechanism using plastic push-pins and springs. This ensures constant pressure (load) on the component for maximum thermal interface contact.
* **Pre-Applied Thermal Interface Material (TIM):** Most versions come with a high-performance thermal pad or phase-change material pre-applied to the base, reducing assembly time.
* **Directional Airflow:** The straight-fin design is optimized for environments where there is a clear, directional path for airflow (e.g., inside a server chassis or telecom rack).
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## 3. Electronic Application
This part is typically used for cooling high-power semiconductors. Common applications include:
1. **FPGA/ASIC Cooling:** For high-speed data processing units that generate significant heat.
2. **Microprocessors:** In industrial embedded systems.
3. **Network Switches:** Used on the main processing chips to prevent thermal throttling.
4. **Power Electronics:** For cooling high-voltage regulators or converters.
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## 4. Part Number Breakdown (Nomenclature)
Understanding the code helps in identifying the series:
* **ATS:** Advanced Thermal Solutions (Manufacturer).
* **01G:** Product Series / Geometry.
* **63:** Specific size/footprint identifier.
* **C2:** Material/Finishing code (Blue Anodized).
* **R0:** Revision or RoHS compliance status.
- ⤷
What is the hole-to-hole spacing for the push-pin mounting on this heat sink?
- ⤷ Can this heat sink be used with a fan for active cooling?
- ⤷ What is the recommended thermal interface material for the ATS-01G series?