The **ATS-01F-99-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink** designed for cooling electronic components like CPUs, GPUs, or power transistors. It is part of the *Advanced Thermal Solutions (ATS) push-pin* series. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 20mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | ~11.51°C/W (at 200 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Electronic/Physical Components The "parts" of this assembly include the heat sink itself and the mechanical mounting hardware required for electronic integration: #### A. The Heat Sink Body * **Material:** Made from **AL6063 aluminum**, which offers high thermal conductivity. * **Design:** The straight-fin design is optimized for **forced air cooling** (where a fan is present). * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766**, a high-performance thermal phase-change material that fills microscopic air gaps between the chip and the heat sink. #### B. Mounting Hardware (Push-Pin) * **Pins:** Usually made of **Nylon 66** (UL94V-0 rated). These are used to snap the heat sink directly into pre-drilled holes on the PCB (Printed Circuit Board). * **Springs:** Included to provide consistent **downward pressure**, ensuring the heat sink stays in contact with the electronic component even under vibration or thermal expansion. --- ### 3. Application Use Cases This part is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling ASICs and FPGAs in networking switches. 2. **Power Electronics:** Dissipating heat from voltage regulators. 3. **Embedded Systems:** Cooling industrial-grade processors where space is limited but thermal loads are high. --- ### 4. Thermal Performance Data Performance varies based on airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200** | 11.51 | | **400** | 4.03 | | **600** | 3.14 | ---