The **ATS-01F-98-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the key physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (H)** | 20mm | | **Thermal Resistance** | 15.31°C/W (Unducted @ 100 LFM) | | **Fin Configuration** | Fine Pitch (Cross-cut) | --- ### 2. Design and Construction This heat sink belongs to the **pushPIN™** line, which is engineered for versatility and ease of installation. * **Fine Pitch Fin Design:** The "98" series features a specific fin density designed to maximize surface area for heat transfer while allowing sufficient airflow between the fins. * **Aluminum Body:** Provides an excellent balance between weight and thermal conductivity. * **Blue Anodized Finish:** Not only provides a professional aesthetic but also adds a layer of protection against corrosion and minor electrical insulation. --- ### 3. Attachment Mechanism One of the defining "electronic parts" of this assembly is the mounting system: 1. **Push-Pins:** Plastic or brass pins that lock into pre-drilled holes on the Printed Circuit Board (PCB). 2. **Compression Springs:** These are integrated into the pins to provide precise downward pressure, ensuring optimal contact between the heat sink base and the electronic chip. 3. **Thermal Interface Material (TIM):** This part usually comes with a pre-applied Phase Change Material (PCM) or thermal grease on the base to fill microscopic air gaps between the component and the heat sink. --- ### 4. Application Use-Cases * **High-Density PCBs:** Suitable for modern boards where space is limited but thermal loads are high. * **Industrial Computing:** Used in embedded systems that require long-term reliability. * **Telecom Hardware:** Ideal for cooling chipsets in routers and switches.