The **ATS-01F-45-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance **Heat Sink** designed for cooling electronic components such as CPUs, GPUs, and other semiconductor packages. --- ### 1. Technical Specifications The following table highlights the physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-01F-45-C3-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | ~15.10 °C/W (Unducted Flow) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Component Breakdown The part number itself contains information about the build and application: * **ATS-01F**: Part of the "push-pin" series designed for secure attachment to PCBs. * **45**: Indicates the specific fin height or configuration within that series. * **C3**: This suffix usually refers to the specific **Thermal Interface Material (TIM)** provided. In this case, it indicates the T766 phase-change material is pre-applied to the base. * **R0**: Refers to the revision code or RoHS compliance (Restriction of Hazardous Substances). --- ### 3. Key Electronic Functions While the heat sink itself is passive (it does not consume electricity), it is critical for the electronic integrity of a system: 1. **Thermal Dissipation**: It increases the surface area of a chip, allowing heat to transfer more efficiently into the surrounding air. 2. **Reliability**: By keeping junction temperatures low, it prevents "Thermal Throttling" and extends the lifespan of the silicon component it protects. 3. **Mechanical Attachment**: The push-pin mechanism provides a consistent "clamping force" which ensures optimal contact between the chip and the heat sink, preventing air gaps that trap heat. --- ### 4. Typical Applications * **Embedded Systems**: Used on small ARM processors or FPGAs. * **Network Hardware**: Cooling for switch chips or routers. * **Industrial PCs**: Providing thermal management in fanless or low-airflow environments.