The **ATS-01F-208-C2-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for effective cooling of electronic components like CPUs, GPUs, and other integrated circuits. ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 70mm x 70mm x 6mm | | **Attachment Type** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 10.50°C/W (Unducted @ 200 LFM) | --- ### 2. Key Component Features #### A. Thermal Interface Material (T766) This part comes with a pre-applied phase-change material. This ensures minimal air gaps between the component (the chip) and the heat sink base, maximizing heat transfer efficiency without the need for manual thermal paste application. #### B. Push-Pin Mounting System Instead of using adhesive tape which can fail under high heat, this model uses a mechanical mounting system: * **Pins:** Made of durable brass. * **Springs:** Provides consistent pressure (clamping force) to ensure the heat sink remains in contact with the component during thermal expansion and vibration. #### C. Aluminum Blue Anodized Finish The blue anodization is not just for aesthetics; it provides: * Increased corrosion resistance. * Enhanced surface emissivity, which slightly improves radiative heat dissipation. * Electrical insulation of the heat sink surface. --- ### 3. Thermal Performance Profile The efficiency of the ATS-01F-208-C2-R0 varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 14.50 | | 200 | 10.50 | | 300 | 8.50 | | 400 | 7.00 | --- ### 4. Typical Applications * **Network Switches/Routers:** Cooling high-speed processors. * **Industrial PCs:** Where vibration resistance is required (push-pins are more secure than tape). * **Embedded Systems:** High-surface-area cooling in a low-profile (6mm height) form factor.