The **ATS-01F-207-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-01F-207-C2-R0 | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Heat Sink Type** | Board Level / Push-Pin Type | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 60mm x 60mm x 25mm | | **Thermal Resistance** | 6.39°C/W (Unducted Flow @ 200 LFM) | | **Attachment Method** | Push-Pin (Plastic) | | **Fin Style** | XC-Cut (Cross-cut) | --- ### 2. Physical Design Features * **XC-Cut Fin Pattern:** The "XC-Cut" design uses cross-cut straight fins. This creates a matrix of pins/fins that allows air to enter the heat sink from any direction (omnidirectional), making it highly effective in compact enclosures where airflow direction may vary. * **Blue Anodization:** The blue coating is not just aesthetic; anodizing increases surface emissivity, which improves heat dissipation via radiation. It also provides corrosion resistance and electrical insulation for the surface of the aluminum. * **Aluminum Construction:** Aluminum (typically 6063 alloy) is used because it offers an excellent balance between high thermal conductivity, low weight, and cost-effectiveness. --- ### 3. Mounting and Interface * **Push-Pin Attachment:** This model uses a plastic push-pin mechanism with a built-in spring. This provides consistent pressure (clamping force) on the high-power component, ensuring better thermal contact. * **Pre-Applied Thermal Interface Material (TIM):** Most "C2" variants come with a pre-applied high-performance thermal pad or grease (such as T766) on the base, reducing assembly time and ensuring optimal heat transfer from the chip to the sink. --- ### 4. Application Use-Cases This heat sink is typically found in: 1. **Networking Hardware:** High-speed routers, switches, and gateways. 2. **Power Electronics:** DC-DC converters and power modules. 3. **Computing:** Chipset cooling on industrial motherboards or FPGA (Field Programmable Gate Array) modules.