The **ATS-01F-197-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" attachment series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (with Brass Spring) | | **Thermal Resistance** | 10.90°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### Key Electronic & Mechanical Components #### 1. Thermal Interface Material (TIM) The "C2" suffix indicates that the part comes with **T766 thermal phase change material**. This is a critical layer that fills microscopic air gaps between the semiconductor die and the aluminum base, ensuring efficient heat transfer. #### 2. Attachment Mechanism (Push Pins) Instead of adhesive tapes, this model uses a mechanical push-pin system. * **Reliability:** Provides constant pressure for better thermal contact. * **Safety:** Prevents the heat sink from shifting during vibration or shipping. * **Hole Pattern:** Requires pre-drilled holes in the PCB (Printed Circuit Board). #### 3. Material Properties * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodizing:** Besides aesthetics, the anodized layer increases surface emissivity (improving radiative heat transfer) and provides a non-conductive protective coating against corrosion. --- ### Performance Overview (Airflow vs. Resistance) Thermal performance varies significantly based on the linear feet per minute (LFM) of airflow: | Airflow Speed (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural) | 10.90 | | 300 (Active) | 4.10 | | 500 (High) | 3.10 | ---