The **ATS-01F-183-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and belongs to their "push-pin" series designed for cooling surface-mount components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Value / Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Type** | Board Level Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions** | 40mm x 40mm x 20mm | | **Thermal Resistance** | 5.37°C/W (@ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Components & Design Features #### A. Fin Profile (Cross-Cut) The "183" in the part number refers to a specific fin pattern. This heat sink uses a **cross-cut** or "pin-fin" design. This allows for multi-directional airflow, making it ideal for systems where the air direction might change or is turbulent. #### B. Push-Pin Attachment Instead of using adhesive tape (which can fail over time) or screws (which require tools), this part uses **brass push-pins** with springs. * **Reliability:** Provides consistent pressure on the component to ensure optimal thermal transfer. * **Safety:** The springs prevent over-tightening which could crack the silicon die. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * This is a phase-change material that fills microscopic air gaps between the chip and the heat sink. * It eliminates the need for manual application of thermal paste. --- ### 3. Thermal Performance Analysis Thermal resistance measures how effectively the part moves heat away from the component. For the **ATS-01F-183-C2-R0**: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 5.37 | | 200 (Moderate) | 3.00 | | 500 (High Speed) | 1.85 | --- ### 4. Typical Applications * **Networking:** Switches and routers where airflow is constant but space is limited. * **Industrial PCs:** Cooling processors in high-vibration environments (push-pins are more secure than tape). * **Power Supplies:** Managing heat on MOSFETs or power regulators. ---