The **ATS-01F-182-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** line, designed to provide efficient cooling for electronic components like processors, ASICs, and GPUs. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Dimensions (L x W x H)** | 40.00 mm x 40.00 mm x 15.00 mm | | **Material** | Aluminum (AL6063) | | **Fin Type** | Fine Pitch | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Interface Material (TIM)** | NO TIM (C1 - Blue Anodized) | | **Flow Pattern** | Straight | --- ## 2. Component Features ### A. Material and Finish * **Aluminum 6063:** This alloy is chosen for its excellent thermal conductivity and structural integrity. * **Blue Anodized:** The "C1" in the part number indicates a blue anodized finish, which provides corrosion resistance and increased surface emissivity for radiative cooling. ### B. pushPIN™ Attachment System This part uses a specific mounting mechanism: * **Spring-loaded bolts:** Provides a constant, high-pressure contact between the heat sink and the component, ensuring maximum heat transfer. * **Plastic/Brass Push Pins:** Allows for easy installation into pre-drilled holes on the PCB. ### C. Thermal Performance The "Fine Pitch" design creates a large surface area within a small footprint (40mm x 40mm). This is ideal for high-density electronic assemblies where airflow might be limited or directed. --- ## 3. Decoding the Part Number | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **01** | Push Pin style | | **F** | Fin pitch (Fine) | | **182** | Specific design/series identifier | | **C1** | Blue Anodized finish | | **R0** | RoHS compliant / Revision | --- ## 4. Typical Applications * **Networking Gear:** Cooling chips in routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Cooling MOSFETs or power modules.