công cụ tìm kiếm bảng dữ liệu linh kiện điện tử
  Vietnamese  ▼
ALLDATASHEET.VN

X  

  • ATS-01F-166-C1-R0

  • AI
    The **ATS-01F-166-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for effective thermal management of electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table outlines the key physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-01F-166-C1-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 10mm | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Interface (TIM)** | T766 (Pre-applied) | | **Fin Style** | Straight Fin | --- ### 2. Design and Components This electronic cooling part consists of four primary integrated elements: * **Heat Sink Body:** Constructed from high-grade aluminum to provide high thermal conductivity while remaining lightweight. The blue anodized finish provides corrosion resistance and increased emissivity. * **Fin Profile:** The 10mm low-profile height is designed for systems with vertical space constraints (small form factor electronics). * **Push-Pin Mounting:** Uses a tool-less attachment system. Two plastic push-pins pass through pre-drilled holes in the PCB and are secured by internal springs. * **Thermal Interface Material (TIM):** The base comes with **T766** phase-change material. This fills microscopic air gaps between the chip and the heat sink to ensure maximum heat transfer. --- ### 3. Thermal Performance Thermal resistance is measured by how effectively the part dissipates heat relative to airflow: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 12.18 | | **400 (2.0 m/s)** | 8.35 | | **600 (3.0 m/s)** | 6.77 | --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs and routers. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Network Hardware:** Cooling high-speed switches or ASICs. * **Consumer Electronics:** Set-top boxes and gaming peripherals.
    ✨ Follow-up Questions
    • ⤷ How does the T766 thermal interface material compare to standard thermal grease?
    • ⤷ What are the PCB hole requirements for mounting this specific push-pin heat sink?
    • ⤷ Are there taller versions of this heat sink for higher power dissipation?