The **ATS-01F-162-C2-R0** is a high-performance heat sink manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" attachment series designed for cooling electronic components such as processors, chipsets, and GPUs. ### Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-01F-162-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 3.62°C/W @ 200 LFM | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Attachment Type** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Components and Design Features #### 1. Heat Sink Body (Heat Spreader) The body is made from **AL6063 aluminum**, which offers a high thermal conductivity-to-weight ratio. The **Blue Anodized** finish isn't just aesthetic; it provides surface protection against corrosion and slightly increases emissivity for better radiation heat transfer. #### 2. Fin Geometry The "162" series typically utilizes a **Straight Fin** design. This is optimized for uni-directional airflow (forced convection), allowing air to pass through the channels with minimal pressure drop while maximizing surface area. #### 3. Attachment System: Push-Pins & Springs Unlike adhesive tapes that can fail over time, this part uses a mechanical **Push-Pin** system: * **Brass Push-Pins:** These provide a secure, vibration-resistant mount to the PCB via pre-drilled holes. * **Compression Springs:** These ensure constant, uniform pressure between the heat sink and the electronic component, which is critical for minimizing thermal contact resistance. #### 4. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * **Function:** T766 is a high-performance phase-change or grease-like material that fills microscopic air gaps between the component and the heat sink. * **Advantage:** Pre-application ensures an even layer and reduces assembly time in manufacturing environments. --- ### Thermal Performance Profile Thermal resistance depends on the airflow velocity (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 4.80 | | 200 | 3.62 | | 300 | 2.90 | | 400 | 2.50 | --- ### Typical Applications * **Networking Gear:** Switches, routers, and high-speed modems. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Voltage regulators and high-power LED drivers.