The **ATS-01F-161-C2-R0** is a high-performance heat sink designed by Advanced Thermal Solutions (ATS). While it is not an electronic component itself (like a resistor or IC), it is a critical thermal management part used to cool electronic devices. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-01F-161-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | ~4.74°C/W @ 1.0 m/s (Airflow dependent) | --- ### 2. Core Design Features * **Fin Geometry:** It features a "Straight Fin" design. This is optimized for systems where there is a clear, directional airflow (forced convection), allowing air to pass through the channels efficiently. * **Material and Coating:** Made of aluminum for lightweight thermal conductivity. The **Blue Anodized** finish is not just for aesthetics; it provides a layer of protection against corrosion and slightly improves surface emissivity for radiation cooling. * **Attachment Mechanism:** The "R0" suffix often indicates the use of the **push-pin** attachment style with a compression spring. This ensures a consistent pressure (Pre-load) against the electronic component, which is vital for maintaining a low thermal interface resistance. --- ### 3. Application in Electronics This heat sink is typically used to cool high-heat-generating components such as: 1. **Processors (CPUs/GPUs):** Small embedded processors or microcontrollers. 2. **FPGAs & ASICs:** High-speed logic gates that generate significant heat during operation. 3. **Power Modules:** Large transistors or voltage regulators that require surface area expansion to prevent thermal throttling. ### 4. Thermal Performance Context The efficiency of the ATS-01F-161-C2-R0 is highly dependent on **Airflow (LFM - Linear Feet per Minute)**. | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (Unducted) | 4.74 | | 400 (Unducted) | 2.57 | | 600 (Unducted) | 2.02 | ---