The **ATS-01F-16-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc.* Below is a detailed breakdown of its specifications, material properties, and technical characteristics. --- ### 1. General Specifications This part belongs to the **blueICE™** series and is designed for component-level cooling (such as CPUs, GPUs, or FPGAs). | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-01F-16-C2-R0 | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Type** | Board Level, High Performance | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 18.08°C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and ensuring clearance from neighboring electronic components. * **Length:** 40.00 mm * **Width:** 40.00 mm * **Height (Fin Depth):** 10.00 mm * **Pin Pitch:** 33.00 mm --- ### 3. Material & Construction The efficiency of a heat sink is determined by its geometry and the conductivity of its material. * **Material:** Aluminum. Aluminum is used for its excellent thermal conductivity-to-weight ratio. * **Finish:** Blue Anodized. The anodization provides corrosion resistance and improves emissivity (heat radiation). * **Fin Style:** **Straight Fin**. This design is optimized for unidirectional airflow. * **Attachment:** **Push-Pin**. This ensures a secure, high-pressure fit against the chip, improving heat transfer efficiency. --- ### 4. Performance Data (Thermal Resistance) Thermal resistance indicates how effectively the part moves heat away from the semiconductor junction to the ambient air. | Airflow Velocity (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 18.08 | | 400 | 2.0 | 8.30 | | 600 | 3.0 | 5.50 | --- ### 5. Application Usage This electronic part is typically found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** Cooling MOSFET arrays or voltage regulators. ---