The **ATS-01F-156-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like processors, FPGAs, and ASICs. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 40.00mm x 40.00mm | | **Height** | 25.00mm | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 4.14°C/W (at 100 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Part Number Breakdown (Deciphering the Code) The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **01**: Series type (typically push-pin attachment). * **F**: Fin pitch/density indicator. * **156**: Specific profile identifier. * **C2**: Color and Finish (Blue Anodized). * **R0**: RoHS Compliance status. --- ### 3. Key Electronic Components & Usage The ATS-01F-156-C2-R0 is an **electronic part** used for **Thermal Management**. Its role is critical in the following ways: 1. **Heat Dissipation**: It increases the surface area of a hot component (like a CPU), allowing air to carry away heat more effectively. 2. **Push-Pin Attachment**: This mechanism ensures a specific amount of pressure (force) is applied to the component, which optimizes the interface between the chip and the heat sink. 3. **Thermal Interface Material (TIM)**: Usually, these heat sinks come with a pre-applied thermal pad or require thermal paste to bridge the microscopic air gaps between the component and the metal. 4. **Airflow Dependency**: The "Straight Fin" design is optimized for environments with consistent directional airflow (forced convection). --- ### 4. Typical Applications * **Networking Equipment**: Switches and routers. * **Embedded Systems**: Industrial computers and controllers. * **Power Supplies**: Cooling high-voltage regulators. * **FPGA Cooling**: High-speed logic gates that generate significant heat.