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  • ATS-01F-148-C2-R0

  • AI
    The **ATS-01F-148-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the blue anodized "push pin" series designed for cooling electronic components like CPUs, GPUs, and power modules. ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push Pin (Plastic) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35mm x 35mm x 15mm | | **Thermal Resistance** | 8.70°C/W (at 200 LFM) | | **Flow Direction** | Fine Pitch (Horizontal) | --- ### 2. Key Electronic Components & Design Features #### A. Thermal Interface Material (TIM) The "R0" suffix indicates that this part comes pre-applied with a **Thermal Interface Material**. This is typically a phase-change material or a high-performance thermal pad that ensures maximum heat transfer from the electronic chip (IC) to the aluminum base of the heat sink. #### B. Attachment System: Push Pins Unlike adhesive-based heat sinks, this model uses a mechanical push-pin system. * **Springs:** Included to provide constant pressure on the chip, preventing "hot spots" caused by uneven contact. * **Installation:** Requires pre-drilled holes in the PCB (Printed Circuit Board). #### C. Heat Sink Geometry * **Fin Pitch:** It utilizes a "Fine Pitch" design. This maximizes the surface area for heat dissipation in environments where there is forced air (fans). * **Material Efficiency:** Using 6063 aluminum provides high thermal conductivity while keeping the weight low to prevent mechanical stress on the PCB traces. --- ### 3. Usage Context This component is commonly found in: 1. **Networking Equipment:** Switches and routers where localized chips generate significant heat. 2. **Embedded Systems:** Industrial PCs where reliability and vibration resistance are required. 3. **Power Electronics:** Cooling MOSFETs or voltage regulators that are mounted in a BGA or square package format. ---
    ✨ Follow-up Questions
    • ⤷What is the difference between push-pin and adhesive heat sink mounting?
    • ⤷ How does the air flow rate (LFM) affect the thermal resistance of this part?
    • ⤷ Can this heat sink be used with custom thermal paste instead of the pre-applied material?