ATS-01F-148-C2-R0
AI

The **ATS-01F-148-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the blue anodized "push pin" series designed for cooling electronic components like CPUs, GPUs, and power modules.
### 1. Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Attachment Method** | Push Pin (Plastic) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 35mm x 35mm x 15mm |
| **Thermal Resistance** | 8.70°C/W (at 200 LFM) |
| **Flow Direction** | Fine Pitch (Horizontal) |
---
### 2. Key Electronic Components & Design Features
#### A. Thermal Interface Material (TIM)
The "R0" suffix indicates that this part comes pre-applied with a **Thermal Interface Material**. This is typically a phase-change material or a high-performance thermal pad that ensures maximum heat transfer from the electronic chip (IC) to the aluminum base of the heat sink.
#### B. Attachment System: Push Pins
Unlike adhesive-based heat sinks, this model uses a mechanical push-pin system.
* **Springs:** Included to provide constant pressure on the chip, preventing "hot spots" caused by uneven contact.
* **Installation:** Requires pre-drilled holes in the PCB (Printed Circuit Board).
#### C. Heat Sink Geometry
* **Fin Pitch:** It utilizes a "Fine Pitch" design. This maximizes the surface area for heat dissipation in environments where there is forced air (fans).
* **Material Efficiency:** Using 6063 aluminum provides high thermal conductivity while keeping the weight low to prevent mechanical stress on the PCB traces.
---
### 3. Usage Context
This component is commonly found in:
1. **Networking Equipment:** Switches and routers where localized chips generate significant heat.
2. **Embedded Systems:** Industrial PCs where reliability and vibration resistance are required.
3. **Power Electronics:** Cooling MOSFETs or voltage regulators that are mounted in a BGA or square package format.
---
- ⤷What is the difference between push-pin and adhesive heat sink mounting?
- ⤷ How does the air flow rate (LFM) affect the thermal resistance of this part?
- ⤷ Can this heat sink be used with custom thermal paste instead of the pre-applied material?