ATS-01F-14-C2-R0
AI

The **ATS-01F-14-C2-R0** is a specific part number for a **high-performance heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors.
### Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Spring Loaded) |
| **Thermal Resistance** | 10.00°C/W (Unducted Flow @ 100 LFM) |
| **Dimensions** | 50mm x 50mm x 25mm |
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### Key Design Elements
#### 1. Heat Sink Profile (Geometry)
The "14" in the part number refers to the **straight-fin** or **cross-cut** design family within the ATS catalog. This specific model features a high-density fin structure to maximize surface area for air convection.
#### 2. Push-Pin Attachment Mechanism
Instead of using messy thermal adhesives or complex screws, this part uses the **pushPIN™** system:
* **Ease of Install:** Uses a flexible attachment tool to snap into pre-drilled holes on the PCB.
* **Consistent Pressure:** Features a brass or plastic push-pin with a stainless steel spring to ensure even pressure across the thermal interface material (TIM).
#### 3. Thermal Interface Material (TIM)
The **C2** designation indicates that the heat sink comes pre-applied with **T766 Phase Change Material**. This simplifies the assembly process and ensures optimal thermal conductivity between the component and the heat sink.
#### 4. Material and Coating
* **Aluminum:** Chosen for its excellent thermal conductivity and lightweight properties.
* **Blue Anodized Finish:** The "R0" suffix indicates the finish. Anodizing protects the aluminum from corrosion and slightly improves radiant heat transfer.
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### Application Usage
This part is typically found in:
* **Network Switches/Routers:** For cooling ASICs.
* **Industrial Power Supplies:** For cooling MOSFETs or IGBTs.
* **Embedded Systems:** High-performance computing boards where vertical space allows for a 25mm height.
- ⤷
What are the alternative attachment methods if my PCB doesn't have holes for push-pins?
- ⤷ How do I calculate if the 10.00°C/W thermal resistance is sufficient for my specific chip?
- ⤷ What is the difference between blue anodized and black anodized heat sinks in terms of performance?