The **ATS-01F-119-C2-R0** is a high-performance electronic component classified as a **Heat Sink**, specifically designed for cooling integrated circuits (ICs) and other electronic packages. It is manufactured by Advanced Thermal Solutions (ATS). --- ### 1. Technical Specifications The following table outlines the mechanical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Part Number** | ATS-01F-119-C2-R0 | | **Heat Sink Type** | Push-Pin (Passive Cooling) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Thermal Resistance** | 4.68°C/W @ 100 LFM | | **Attachment Method** | Plastic Push-Pins with Springs | --- ### 2. Key Design Features #### A. Fin Geometry This model utilizes a **Straight Fin** design. This is optimized for uni-directional airflow, making it ideal for systems where a chassis fan provides a consistent stream of air over the component. #### B. Material and Coating * **Aluminum:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Not only provides aesthetic value but also increases corrosion resistance and emissivity (which slightly improves radiant heat transfer). #### C. The "push-pin" Mounting System The `ATS-01F-119-C2-R0` features a pre-drilled hole pattern for **Push-Pin** attachment. * **Benefits:** This ensures consistent pressure between the heat sink and the chip, maximizing the effectiveness of the Thermal Interface Material (TIM). * **Springs:** The pins are usually equipped with compression springs to prevent mechanical stress from damaging the PCB. --- ### 3. Application Use Cases This specific heat sink is typically used in the following electronic environments: 1. **Network Switches/Routers:** Cooling BGAs and CPUs. 2. **Embedded Systems:** For industrial computers where airflow is managed. 3. **Power Electronics:** Dissipating heat from high-speed transistors or voltage regulators. --- ### 4. Thermal Performance Comparison The effectiveness of this heat sink changes based on the Linear Feet per Minute (LFM) of airflow: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100** | 4.68 | | **200** | 2.72 | | **300** | 2.13 | | **400** | 1.86 |