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  • ATS-01F-103-C2-R1

  • AI
    The **ATS-01F-103-C2-R1** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). While it does not contain active silicon components like transistors or ICs, it is a critical "passive" electronic part used for thermal management in power electronics. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions** | 40mm x 40mm x 30mm | | **Thermal Resistance** | 9.47°C/W (at 100 LFM) | | **Flow Type** | Fine Pitch (straight fin) | --- ### 2. Key Design Elements #### A. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a **push-pin and spring mechanism**. This provides: * **Constant Pressure:** Ensures a firm interface between the heat sink and the heat-generating component (e.g., a CPU or MOSFET). * **Reliability:** Mechanical mounting is less likely to fail under high vibration or heat compared to thermal tape. #### B. Material and Finish * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodization:** This is not just for aesthetics; the anodized layer provides increased corrosion resistance and slightly improves radiative heat transfer. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that the heat sink comes pre-applied with **ATS-PPS-02** thermal interface material. This eliminates the need for manual application of thermal paste and ensures optimal heat transfer from the chip to the aluminum fins. --- ### 3. Electronic Application This part is typically used to cool high-heat electronic components such as: 1. **Microprocessors (CPUs) and FPGAs:** In embedded systems where space is limited but heat output is high. 2. **Voltage Regulators:** To prevent thermal throttling in power delivery circuits. 3. **High-Speed Networking Chips:** Found in routers and switches. ---
    ✨ Follow-up Questions
    • ⤷ What are the specific hole patterns required on the PCB for this heat sink?
    • ⤷ How does the 'C2' thermal interface material compare to high-performance thermal grease?
    • ⤷ What are the airflow requirements to reach the minimum thermal resistance?