ATS-01F-103-C2-R1
AI

The **ATS-01F-103-C2-R1** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). While it does not contain active silicon components like transistors or ICs, it is a critical "passive" electronic part used for thermal management in power electronics.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Dimensions** | 40mm x 40mm x 30mm |
| **Thermal Resistance** | 9.47°C/W (at 100 LFM) |
| **Flow Type** | Fine Pitch (straight fin) |
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### 2. Key Design Elements
#### A. The pushPIN™ Attachment System
Unlike adhesive-based heat sinks, this model uses a **push-pin and spring mechanism**. This provides:
* **Constant Pressure:** Ensures a firm interface between the heat sink and the heat-generating component (e.g., a CPU or MOSFET).
* **Reliability:** Mechanical mounting is less likely to fail under high vibration or heat compared to thermal tape.
#### B. Material and Finish
* **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties.
* **Blue Anodization:** This is not just for aesthetics; the anodized layer provides increased corrosion resistance and slightly improves radiative heat transfer.
#### C. Thermal Interface Material (TIM)
The "C2" in the part number indicates that the heat sink comes pre-applied with **ATS-PPS-02** thermal interface material. This eliminates the need for manual application of thermal paste and ensures optimal heat transfer from the chip to the aluminum fins.
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### 3. Electronic Application
This part is typically used to cool high-heat electronic components such as:
1. **Microprocessors (CPUs) and FPGAs:** In embedded systems where space is limited but heat output is high.
2. **Voltage Regulators:** To prevent thermal throttling in power delivery circuits.
3. **High-Speed Networking Chips:** Found in routers and switches.
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- ⤷
What are the specific hole patterns required on the PCB for this heat sink?
- ⤷ How does the 'C2' thermal interface material compare to high-performance thermal grease?
- ⤷ What are the airflow requirements to reach the minimum thermal resistance?