The **ATS-01F-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or damage. --- ### Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Dimensions (L x W x H)** | 40mm x 40mm x 30mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 6.69°C/W (at 100 LFM) | | **Fin Style** | Straight Fin | --- ### Key Electronic & Mechanical Features #### 1. Thermal Dissipation (Efficiency) The "C2" in the part number indicates a specific thermal performance profile. With a thermal resistance of approximately **6.69°C/W** at low airflow, it is designed for environments where cooling efficiency is critical despite limited space. #### 2. pushPIN™ Attachment Mechanism Unlike adhesive-based heat sinks, this part uses a mechanical **pushPIN™** system: * **Secure Fit:** Provides consistent pressure across the component surface to maximize thermal transfer. * **Reliability:** Resistant to vibrations and thermal expansion cycles that often cause adhesives to fail. * **Ease of Installation:** Uses pre-drilled holes in the PCB for quick assembly. #### 3. Material and Coating * **Aluminum Construction:** Offers a high strength-to-weight ratio and excellent thermal conductivity. * **Blue Anodized Finish:** Provides a protective layer against corrosion and improves surface emissivity (radiation heat transfer). #### 4. Fin Design The straight-fin design is optimized for **forced air cooling** (using a fan). The gaps between the 30mm tall fins allow air to flow through the sink, carrying heat away from the baseplate connected to the electronic chip. --- ### Common Applications * **Network Switches/Routers:** Cooling high-speed processing chips. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. * **Embedded Systems:** Industrial PCs where high-profile cooling is required.