## Technical Overview: ATS-01E-75-C3-R0 The **ATS-01E-75-C3-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). This specific part belongs to the **pushPIN™** series, designed for efficient thermal management of electronic components such as CPUs, GPUs, and high-power chipsets. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Attachment Type** | Push-Pin (R0 mechanism) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 14.95° C/W (at 100 LFM) | | **Dimensions** | 25mm x 25mm x 30mm | --- ### 2. Physical Design and Dimensions The physical geometry is critical for ensuring the heat sink fits within the spatial constraints of a Printed Circuit Board (PCB). * **Height:** 30.00 mm (High profile for better surface area) * **Length/Width:** 25.00 mm x 25.00 mm * **Pitch (Hole spacing):** 30.00 mm (Standard spacing for mounting) --- ### 3. Thermal Performance Profile Thermal resistance measures how effectively the part moves heat away from the electronic component. It is measured in degrees Celsius per Watt (°C/W). | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 LFM (0.5 m/s) | 14.95 | | 300 LFM (1.5 m/s) | 5.25 | | 500 LFM (2.5 m/s) | 3.55 | | 700 LFM (3.5 m/s) | 2.80 | --- ### 4. Mounting Mechanism: pushPIN™ The suffix **R0** indicates the specific hardware used for attachment: * **Push-Pin:** Features a flexible, spring-loaded plastic or brass pin that snaps into the PCB holes. * **Springs:** Uses a compression spring to provide precise pressure (preload) against the component, ensuring optimal thermal interface material (TIM) contact. * **Reliability:** Designed for high-vibration environments and easy field replacement. --- ### 5. Application Use Cases * **Embedded Systems:** Small form factor industrial PCs. * **Telecommunications:** High-speed routers and switches where local airflow is available. * **Power Electronics:** Voltage regulators or MOSFET arrays requiring vertical heat dissipation.