ATS-01E-159-C1-R0
AI

The **ATS-01E-159-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **push-pin** attachment series designed for cooling electronic components such as CPUs, GPUs, and high-power integrated circuits.
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### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Type** | Push-Pin (Brass with Plastic Tip) |
| **Thermal Resistance** | 2.07°C/W @ 200 LFM |
| **Dimensions (L x W x H)** | 45mm x 45mm x 10mm |
| **Fin Style** | Straight (Square) |
| **Thermal Interface Material (TIM)** | T766 (High Performance) |
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### 2. Physical Design and Construction
### Fin Configuration
The "159" series features a **Straight-Fin** design. This is optimized for airflow that moves linearly across the component. The 10mm height makes it a "low profile" solution, suitable for compact server blades or small-form-factor (SFF) devices where vertical space is limited.
### Attachment Mechanism
The **Push-Pin** system is a critical electronic hardware feature:
* **Reliability:** It provides consistent pressure on the semiconductor, ensuring optimal contact with the Thermal Interface Material (TIM).
* **Springs:** The pins are typically equipped with springs to prevent over-compression and allow for thermal expansion of the board without cracking the PCB.
### Surface Treatment
The **Blue Anodizing** is not just for aesthetics; it increases the surface emissivity, slightly improving radiation heat transfer, and provides a layer of electrical insulation and corrosion resistance to the aluminum body.
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### 3. Thermal Performance Profile
The effectiveness of this part depends heavily on the airflow (measured in Linear Feet per Minute - LFM).
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 200 | 2.07 |
| 300 | 1.60 |
| 400 | 1.37 |
| 500 | 1.23 |
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### 4. Part Number Breakdown (Nomenclature)
* **ATS**: Manufacturer (Advanced Thermal Solutions).
* **01E**: Specific series/attachment style.
* **159**: Dimensional/Fin configuration code.
* **C1**: Material and Finish code (typically Aluminum/Blue Anodized).
* **R0**: Revision or specific packaging code.
- ⤷
How do I calculate the required airflow (LFM) for this heat sink based on my chip's wattage?
- ⤷ What is the specific footprint and hole pattern required on the PCB for the push-pins?
- ⤷ Can the T766 thermal interface material be replaced with a different compound?