công cụ tìm kiếm bảng dữ liệu linh kiện điện tử
  Vietnamese  ▼
ALLDATASHEET.VN

X  

  • ATS-01E-159-C1-R0

  • AI
    The **ATS-01E-159-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **push-pin** attachment series designed for cooling electronic components such as CPUs, GPUs, and high-power integrated circuits. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Brass with Plastic Tip) | | **Thermal Resistance** | 2.07°C/W @ 200 LFM | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Fin Style** | Straight (Square) | | **Thermal Interface Material (TIM)** | T766 (High Performance) | --- ### 2. Physical Design and Construction ### Fin Configuration The "159" series features a **Straight-Fin** design. This is optimized for airflow that moves linearly across the component. The 10mm height makes it a "low profile" solution, suitable for compact server blades or small-form-factor (SFF) devices where vertical space is limited. ### Attachment Mechanism The **Push-Pin** system is a critical electronic hardware feature: * **Reliability:** It provides consistent pressure on the semiconductor, ensuring optimal contact with the Thermal Interface Material (TIM). * **Springs:** The pins are typically equipped with springs to prevent over-compression and allow for thermal expansion of the board without cracking the PCB. ### Surface Treatment The **Blue Anodizing** is not just for aesthetics; it increases the surface emissivity, slightly improving radiation heat transfer, and provides a layer of electrical insulation and corrosion resistance to the aluminum body. --- ### 3. Thermal Performance Profile The effectiveness of this part depends heavily on the airflow (measured in Linear Feet per Minute - LFM). | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 2.07 | | 300 | 1.60 | | 400 | 1.37 | | 500 | 1.23 | --- ### 4. Part Number Breakdown (Nomenclature) * **ATS**: Manufacturer (Advanced Thermal Solutions). * **01E**: Specific series/attachment style. * **159**: Dimensional/Fin configuration code. * **C1**: Material and Finish code (typically Aluminum/Blue Anodized). * **R0**: Revision or specific packaging code.
    ✨ Follow-up Questions
    • ⤷ How do I calculate the required airflow (LFM) for this heat sink based on my chip's wattage?
    • ⤷ What is the specific footprint and hole pattern required on the PCB for the push-pins?
    • ⤷ Can the T766 thermal interface material be replaced with a different compound?