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  • ATS-01E-151-C2-R0

  • AI
    The **ATS-01E-151-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "Blue Anodized" series designed for component-level cooling, typically used on CPUs, GPUs, and other high-heat surface-mount components. --- ## 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 20.0mm | | **Thermal Resistance** | 3.99°C/W (Natural Convection) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Airflow Path** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Features and Components ### A. pushPIN™ Attachment System The "R0" suffix indicates the use of the ATS pushPIN™ system. This mechanism provides: * **Constant Pressure:** Ensures a firm, even contact between the heat sink and the component, optimizing heat transfer. * **Ease of Assembly:** Quick installation into pre-drilled holes in the PCB. * **Reliability:** Resistant to vibration and shock, making it suitable for industrial or telecommunications hardware. ### B. Material and Coating * **Aluminum Construction:** Offers a lightweight balance between thermal conductivity and cost. * **Blue Anodizing:** The coating is not just aesthetic; it provides corrosion resistance and increases surface emissivity, which slightly improves radiant heat transfer. ### C. Thermal Interface Material (TIM) This specific part comes with **T766** pre-applied. T766 is a phase-change thermal pad that softens at operating temperatures to fill microscopic air gaps between the component and the heat sink base. --- ## 3. Performance Analysis The heat sink's efficiency depends heavily on the airflow speed (measured in Linear Feet per Minute - LFM): * **Low Airflow (200 LFM):** Resistance drops significantly compared to natural convection. * **Design Intent:** The 20,00mm height and straight fin design are optimized for systems with a dedicated cooling fan or localized ducting. ---
    ✨ Follow-up Questions
    • ⤷What are the PCB hole diameter requirements for the pushPIN system?
    • ⤷ Is there a version of this heat sink with a different height?
    • ⤷ How does the T766 TIM compare to standard thermal grease?