ATS-01E-151-C2-R0
AI

The **ATS-01E-151-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "Blue Anodized" series designed for component-level cooling, typically used on CPUs, GPUs, and other high-heat surface-mount components.
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## 1. Technical Specifications
The following table summarizes the key physical and thermal characteristics of the part:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (Al) |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 20.0mm |
| **Thermal Resistance** | 3.99°C/W (Natural Convection) |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Airflow Path** | Straight Fin |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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## 2. Key Features and Components
### A. pushPIN™ Attachment System
The "R0" suffix indicates the use of the ATS pushPIN™ system. This mechanism provides:
* **Constant Pressure:** Ensures a firm, even contact between the heat sink and the component, optimizing heat transfer.
* **Ease of Assembly:** Quick installation into pre-drilled holes in the PCB.
* **Reliability:** Resistant to vibration and shock, making it suitable for industrial or telecommunications hardware.
### B. Material and Coating
* **Aluminum Construction:** Offers a lightweight balance between thermal conductivity and cost.
* **Blue Anodizing:** The coating is not just aesthetic; it provides corrosion resistance and increases surface emissivity, which slightly improves radiant heat transfer.
### C. Thermal Interface Material (TIM)
This specific part comes with **T766** pre-applied. T766 is a phase-change thermal pad that softens at operating temperatures to fill microscopic air gaps between the component and the heat sink base.
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## 3. Performance Analysis
The heat sink's efficiency depends heavily on the airflow speed (measured in Linear Feet per Minute - LFM):
* **Low Airflow (200 LFM):** Resistance drops significantly compared to natural convection.
* **Design Intent:** The 20,00mm height and straight fin design are optimized for systems with a dedicated cooling fan or localized ducting.
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- ⤷What are the PCB hole diameter requirements for the pushPIN system?
- ⤷ Is there a version of this heat sink with a different height?
- ⤷ How does the T766 TIM compare to standard thermal grease?