The **ATS-01D-98-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). Below is a detailed breakdown of its electronic and physical specifications. ### 1. General Specifications This part belongs to the **pushPIN™** series, designed for easy installation and reliable pressure on the component requiring cooling (such as a CPU, GPU, or FPGA). | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-01D-98-C2-R0 | | **Material** | Aluminum (AL6063) | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Finish** | Blue Anodized | | **Thermal Interface** | T766 (Pre-applied Phase Change Material) | --- ### 2. Physical Dimensions The physical footprint determines which electronic packages (like BGA or LGA) the heat sink can fit. | Dimension | Value (mm) | | :--- | :--- | | **Width / Length** | 45.00 mm x 45.00 mm | | **Height** | 20.00 mm | | **Pitch (Hole Pattern)** | 50.00 mm x 50.00 mm | --- ### 3. Thermal Performance Thermal resistance is the most critical "electronic" metric, as it determines how many degrees Celsius the component's temperature will rise per watt of power dissipated. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100 LFM (0.5 m/s)** | 15.31 | | **300 LFM (1.5 m/s)** | 5.81 | | **500 LFM (2.5 m/s)** | 3.54 | | **700 LFM (3.5 m/s)** | 2.66 | --- ### 4. Key Electronic Design Features * **Fin Pitch:** This model features a **Fine-Pitch** design. In electronics, fine-pitch heat sinks are preferred when there is forced air (fans) available, as they provide more surface area for heat exchange. * **Thermal Interface Material (TIM):** It comes pre-applied with **T766**. This is a high-conductivity material that fills microscopic air gaps between the electronic chip and the heat sink base to ensure maximum heat transfer. * **Spring-Loaded Mounting:** The pushPIN™ mechanism uses a precise spring constant to apply "Calculated Pressure." This prevents the heat sink from cracking delicate silicon dies while ensuring it doesn't move during mechanical shock or vibration. ---