The **ATS-01D-95-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Series** | blueICE™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Heat Sink Type** | Push-Pin (Passive) | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Thermal Resistance** | 7.29°C/W (at 100 LFM) | | **Fin Pattern** | Square Pin Fin | --- ### 2. Electronic Application & Performance The ATS-01D-95-C2-R0 is engineered for versatility in electronic enclosures. Its performance is heavily dependent on the airflow (measured in Linear Feet per Minute - LFM). #### Thermal Resistance Data | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **Unducted (Natural)** | 7.29 | | **200 LFM** | 5.24 | | **400 LFM** | 3.83 | | **600 LFM** | 3.14 | --- ### 3. Design Features * **Square Pin Fin Geometry:** Unlike straight fins, pin fins allow for multi-directional airflow. This makes it ideal for electronics where the direction of the cooling fan may not be fixed or consistent. * **Push-Pin Mounting:** The "01D" designation indicates a specific push-pin and spring mounting system. This provides a consistent pressure (Force) on the electronic chip, ensuring a better interface between the component and the heat sink. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. T766 is a high-performance thermal grease or pad that fills microscopic air gaps between the heat sink and the electronic component. ### 4. Typical Use Cases * **Embedded Systems:** Used on SoCs (System on Chips) that run at high frequencies. * **Telecommunications:** Cooling of networking processors in switches or routers. * **Industrial Power Supplies:** Cooling of MOSFETs or IGBTs. ---